奥地利半导体与集成电路供应商

F&S BONDTEC Semiconductor GmbH is an Austrian manufacturer of semiconductor bonding equipment, including manual, semi-automatic, and automatic wire bonders and die bonders. The company also produces manual and fully automatic bond testers such as the patented BAMFIT 5600Ci, along with related accessories and contract bonding services. Based in Braunau am Inn, it serves the electronics and semiconductor packaging industries with in-house production technologies.